The thermal pad is silicone-based with modeling clay-like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating. Due to the consistency, only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows the best cooling for tough cooling operations such as voltage regulators and memory ICs. Most excellent thermal conductivity No bleeding long-term stability high compression rate