The Minus Pad extreme 2 thermal pad is designed to deliver top-tier heat dissipation in precision cooling applications. With a large format of 100 x 100 mm and a thickness of 0.5 mm, this pad is ideal where you need full coverage or custom cutting. Its specially formulated composite material-comprising aluminum oxide, aluminum hydroxide, and aluminum powder-allows it to fill microscopic interface gaps and voids, thereby reducing thermal resistance and improving heat transfer between heat sources and sinks. Unlike many conventional pads, the Minus Pad extreme 2 does not cure or harden over time, preserving its thermal performance through extended operation cycles. It remains electrically non-conductive, making it safe for use in sensitive electronic assemblies without risk of electrical shorting. Its soft consistency ensures excellent surface conformity, even on slightly uneven surfaces, ensuring maximum area. Available in multiple thickness options (0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm), this pad is versatile for a wide range of gap tolerances. Whether used in high-end CPU, GPU, power electronics, or custom cooling scenarios, the Minus Pad extreme 2 stands out as a reliable, high-performance solution for thermal management needs.
Optimized successor generation - Minus Pad Extreme 2 is the advanced version of the proven Minus Pad Extreme with improved material composition for maximum efficiency.
Superior thermal conductivity - Sets the benchmark in the TG portfolio of thermal pads, ensuring excellent heat transfer for GPU, SSD, RAM and gaming consoles.
For high-performance applications - Specially designed for demanding hardware such as graphics cards, memory and consoles requiring maximum cooling performance.
Non-hardening - Soft and adaptable consistency remains flexible over time and makes installation easier.
Electrically non-conductive - Provides maximum safety when used on sensitive electronic components.